Laird Technologies450-0097RF/Drahtlos-Entwicklungsplatinen und Kits

Combo Wireless Module Adapter Card

  • Entwicklungskit-Beschreibung

    COM6L for the TiWi5 & TiWi-BLE modules. These evaluation modules utilize a special 100 pin card-edge commonly found in the Texas Instruments MPU development platforms.

  • Entwicklungskit-Funktionen

    • Supports requirements for the TI COM (Connectivity On Module) solutions
    • Supports BeagleBoard and BeagleBoard-XM with adapter
    • Utilizes the FCC / IC certifi ed and ETSI tested LSR dipole antenna
    • Dimensions: .955 X 1.495 inches
    • Ships with TiWi-BLE U.FL module

A datasheet is only available for this product at this time.