Amphenol Communications Solutions95278-402-08LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Unshrouded Header | |
| HDR | |
| 8 | |
| 2 | |
| Solder | |
| 2.54 | |
| Straight | |
| 2.54 | |
| 3/Contact | |
| 1500VAC | |
| 5000 | |
| -65 | |
| 125 | |
| Bulk | |
| 10.16 | |
| 7.3 | |
| 11.8 | |
| Surface Mount |
| EDA / CAD Models |