Amphenol Communications Solutions95278-402-08LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating