| Compliant | |
| EAR99 | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.38(Max) |
| Verpackungsbreite | 2 |
| Verpackungslänge | 1.3 |
| Leiterplatte geändert | 6 |
| Standard-Verpackungsname | TSNP |
| Lieferantenverpackung | TSNP EP |
| 6 |
Receiving a weak signal? Amplify it with this general purpose amplifier BGA777N7E6327XTSA1 buffer amplifier from Infineon Technologies, for a better signal. This RF amplifier chip has a minimum operating temperature of -30 °C and a maximum of 85 °C. Tape and reel packaging will encase the product during shipment, ensuring safe delivery and enabling quick mounting of components. This device uses a single power supply. It has a single channel per chip.
| EDA / CAD Models |