Infineon Technologies AGCY62177G30-55BAXISRAM-Chip
SRAM Chip Async Single 3V/3.3V 32M-bit 2M x 16 55ns 48-Pin FBGA Bulk
| Compliant | |
| 3A991.b.2.a | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.91(Max) |
| Verpackungsbreite | 8 |
| Verpackungslänge | 9.5 |
| Leiterplatte geändert | 48 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 48 | |
| Leitungsform | Ball |
| EDA / CAD Models |