Infineon Technologies AGCY7C2663KV18-550BZXISRAM-Chip
SRAM Chip Sync Dual 1.8V 144M-bit 8M x 18 0.45ns 165-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.89 |
| Verpackungsbreite | 15 |
| Verpackungslänge | 17 |
| Leiterplatte geändert | 165 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 165 | |
| Leitungsform | Ball |
| EDA / CAD Models |