| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.33.00.01 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1(Max) mm |
| Verpackungsbreite | 2.05(Max) mm |
| Verpackungslänge | 2.05(Max) mm |
| Leiterplatte geändert | 6 |
| Standard-Verpackungsname | DFN |
| Lieferantenverpackung | DFN EP |
| 6 | |
| Leitungsform | No Lead |
Fine-tune your RF signal with this general purpose amplifier HMC667LP2E buffer amplifier from Analog Devices. Its maximum power dissipation is 380 mW. This RF amplifier chip has a minimum operating temperature of -40 °C and a maximum of 85 °C. This product will be shipped in tape and reel packaging for quick mounting and safe delivery. This device uses a single power supply. It has a single channel per chip.
| EDA / CAD Models |