Infineon Technologies AGIGCM04B60GAXKMA1Intelligent Power Modules
High Reliability Intelligent Power Modules IC
| Compliant | |
| EAR99 | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Befestigung | Through Hole |
| Verpackungshöhe | 3.1 |
| Verpackungsbreite | 21 |
| Verpackungslänge | 36 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | DIP |
| Lieferantenverpackung | MDIP |
| 24 |
| EDA / CAD Models |