Integrated Silicon Solution IncIS65WV102416BLL25MLA3SRAM-Chip
SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 25ns 48-Pin TFBGA Automotive AEC-Q100
| Compliant | |
| 3A991.b.2.a | |
| Active | |
| 8542.32.00.41 | |
| Automotive | Yes |
| PPAP | Yes |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.9(Max) |
| Verpackungsbreite | 9 |
| Verpackungslänge | 11 |
| Leiterplatte geändert | 48 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 48 | |
| Leitungsform | Ball |
| EDA / CAD Models |