Samsung Electronics-K4FBE3D4HB-MGCL000 DRAM-Chip DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.2V/1.8V 200-Pin FBGA

Video Transcript

Samsung ElectronicsK4FBE3D4HB-MGCL000DRAM-Chip

DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.2V/1.8V 200-Pin FBGA

Symbols and Footprints

EAR99

Unconfirmed

EA

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungshöhe

0.68

Verpackungsbreite

10

Verpackungslänge

15

Leiterplatte geändert

200

Standard-Verpackungsname

BGA

Lieferantenverpackung

FBGA

200

EDA / CAD Models

A datasheet is only available for this product at this time.