Samsung Electronics-K4G41325FE-HC25 DRAM-Chip DRAM Chip GDDR5 SGRAM 4Gbit 128Mx32 1.35V/1.5V 170-Pin FBGA

Video Transcript

Samsung ElectronicsK4G41325FE-HC25DRAM-Chip

DRAM Chip GDDR5 SGRAM 4Gbit 128Mx32 1.35V/1.5V 170-Pin FBGA

Symbols and Footprints

Compliant

EAR99

Obsolete

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungsbreite

12

Verpackungslänge

14

Leiterplatte geändert

170

Standard-Verpackungsname

BGA

Lieferantenverpackung

FBGA

170

Leitungsform

Ball

EDA / CAD Models

A datasheet is only available for this product at this time.