Samsung Electronics-K4S283233F-HN75000 DRAM-Chip null

Video Transcript

Samsung ElectronicsK4S283233F-HN75000DRAM-Chip

DRAM Chip Mobile SDRAM 128Mbit 4Mx32 3V 90-Pin FBGA Tray

Symbols and Footprints

EAR99

Obsolete

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungshöhe

0.75

Verpackungsbreite

8

Verpackungslänge

13

Leiterplatte geändert

90

Standard-Verpackungsname

BGA

Lieferantenverpackung

FBGA

90

Leitungsform

Ball

EDA / CAD Models

A datasheet is only available for this product at this time.