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NXP SemiconductorsMC13892CJVKPMIC-Lösungen
Application Processors to 139-Pin BGA Tray
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.60 | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Application Processors | |
| -40 | |
| 85 | |
| Tray | |
| 150 | |
| -65 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.92 mm |
| Verpackungsbreite | 7 mm |
| Verpackungslänge | 7 mm |
| Leiterplatte geändert | 139 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 139 | |
| Leitungsform | Ball |
| EDA / CAD Models |