NXP SemiconductorsMC13892CJVLPMIC-Lösungen
Application Processors to 186-Pin BGA Tray
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.60 | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Application Processors | |
| -40 | |
| 85 | |
| Tray | |
| 150 | |
| -65 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.18 mm |
| Verpackungsbreite | 12 mm |
| Verpackungslänge | 12 mm |
| Leiterplatte geändert | 186 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 186 | |
| Leitungsform | Ball |
| EDA / CAD Models |