NXP SemiconductorsMC33FS6522LAE
High Performance System Basis Chip IC Automotive AEC-Q100
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.60 | |
| SVHC | Yes |
| Automotive | Yes |
| PPAP | Yes |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.45(Max) mm |
| Verpackungsbreite | 7 mm |
| Verpackungslänge | 7 mm |
| Leiterplatte geändert | 48 |
| Standard-Verpackungsname | QFP |
| Lieferantenverpackung | HLQFP EP |
| 48 | |
| Leitungsform | Gull-wing |
| EDA / CAD Models |