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NXP SemiconductorsMPC8323VRADDCAMikroprozessor
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 90nm 266MHz 1.8V/2.5V/3.3V 516-Pin TEBGA Tray
| Compliant | |
| 3A991a.2. | |
| NRND | |
| 8542.31.00.50 | |
| Automotive | No |
| PPAP | No |
| PowerQUICC II Pro MPC83xx Processor | |
| RISC | |
| e300 | |
| 1 | |
| 32 | |
| 16KB | |
| I2C/SPI/UART/USB | |
| 266 | |
| 2 | |
| 0 | |
| 16KB | |
| 1 | |
| No | |
| 2 | |
| 1 | |
| 0 | |
| 0 | |
| 0 | |
| 10Mbps/100Mbps | |
| 0.95 | |
| 1 | |
| 1.05 | |
| 1.8|2.5|3.3 | |
| 1480 | |
| 0 | |
| 105 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.95(Max) |
| Verpackungsbreite | 27 |
| Verpackungslänge | 27 |
| Leiterplatte geändert | 516 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TEBGA |
| 516 | |
| Leitungsform | Ball |
| EDA / CAD Models |