Micron TechnologyMT29RZ4C4DZZMGMF-18W.80CMulti-Chip Package Memory
4Gbit NAND and 4Gbit LPDDR2 168-Ball MCP
| Compliant | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Leiterplatte geändert | 168 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 168 | |
| Leitungsform | Ball |
| EDA / CAD Models |