Cypress SemiconductorS71KL512SC0BHV000Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 DDR DRAM 3V 24-Pin FBGA Tray
| Compliant | |
| 3A991.B.1.A | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 512M | |
| 64M | |
| 64Mx8 Flash + 8Mx8 DDR DRAM | |
| Yes | |
| 65nm | |
| 3 | |
| -40 | |
| 105 | |
| Industrial Plus | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1(Max) - 0.2(Min) |
| Verpackungsbreite | 6 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |