Infineon Technologies AGS76HS512TC0BHB010Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 PSRAM 1.8V Automotive AEC-Q100 24-Pin FBGA Tray
Compliant | |
3A991.b.1.a | |
Active | |
8542.32.00.71 | |
Automotive | Yes |
PPAP | Yes |
512M | |
64M | |
64Mx8 Flash + 8Mx8 PSRAM | |
1.7 | |
1.8 | |
2 | |
-40 | |
105 | |
Automotive | |
Tray | |
Befestigung | Surface Mount |
Verpackungshöhe | 1.2(Max) - 0.2(Min) |
Verpackungsbreite | 8 |
Verpackungslänge | 8 |
Leiterplatte geändert | 24 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | FBGA |
24 |