Infineon Technologies AGS78HS512TC0BHB010Multi-Chip Package Memory
MCP 64Mx8 Flash + 8Mx8 PSRAM 1.8V Automotive AEC-Q100 24-Pin FBGA Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.2(Max) - 0.2(Min) |
| Verpackungsbreite | 8 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 24 |
| EDA / CAD Models |