Silicon Motion TechnologySM662PX8-ACSFlash
MLC NAND Flash Serial e-MMC 64G-bit Automotive AEC-Q100 153-Pin BGA Tray
| Compliant | |
| EAR99 | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Unknown |
| MLC NAND | |
| 64G | |
| No | |
| Yes | |
| Synchronous | |
| Serial e-MMC | |
| -25 | |
| 85 | |
| Commercial | |
| Yes | |
| Yes | |
| No | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.4 mm |
| Verpackungsbreite | 14 mm |
| Verpackungslänge | 18 mm |
| Leiterplatte geändert | 153 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 153 | |
| Leitungsform | Ball |
| EDA / CAD Models |