CUI DevicesTBP02R2W-381-16BESteckverbinderleisten und Leiterplattenbuchsen
Conn Wire to Board HDR 16 POS 3.81mm Solder ST Top Entry Thru-Hole
| EAR99 | |
| Active | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | No |
| PPAP | No |
| Wire to Board | |
| HDR | |
| 16 | |
| 1 | |
| Solder | |
| 3.81 | |
| Straight | |
| Center Key | |
| 8/Contact | |
| 300V | |
| 500 | |
| 20 | |
| -40 | |
| 105 | |
| 71.35 | |
| 7.2 | |
| 9.2 | |
| Through Hole |
| EDA / CAD Models |