Winbond ElectronicsW25M321AVEITMulti-Chip Package Memory
MCP 4Mx8 NOR Flash + 128Mx8 NAND Flash 3V/3.3V 8-Pin WSON EP Tray
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 32M|1G | |
| 4Mx8 NOR Flash + 128Mx8 NAND Flash | |
| 7 | |
| Yes | |
| 2.7 | |
| 3|3.3 | |
| 3.6 | |
| -40 | |
| 85 | |
| Industrial | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.73 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 6 |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | SON |
| Lieferantenverpackung | WSON EP |
| 8 |
| EDA / CAD Models |