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Winbond ElectronicsW25N01GVTBIGFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85 mm |
| Verpackungsbreite | 6 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |