Winbond ElectronicsW25N01GVTCITFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tray
3A991.b.1.a | |
Active | |
8542.32.00.71 | |
Automotive | No |
PPAP | No |
SLC NAND | |
1G | |
Sectored | |
No | |
Symmetrical | |
32 | |
Yes | |
Synchronous | |
7 | |
0.01/Block | |
0.7/Page | |
Serial (SPI, Dual SPI, Quad SPI) | |
2.7 | |
3|3.3 | |
3.6 | |
2.7 to 3.6 | |
35 | |
35 | |
-40 | |
85 | |
Industrial | |
Yes | |
Yes | |
No | |
Tray | |
Befestigung | Surface Mount |
Verpackungshöhe | 0.85(Max) |
Verpackungsbreite | 6 |
Verpackungslänge | 8 |
Leiterplatte geändert | 24 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | TFBGA |
24 |