Winbond ElectronicsW25N02JWSFIFFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 2G-bit 256M x 8 6ns 16-Pin SOIC W Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 2G | |
| No | |
| 32 | |
| 2Kbyte | |
| 8 | |
| 256M | |
| Yes | |
| Synchronous | |
| 6 | |
| 0.01/Block | |
| 0.7 | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| 1.7 to 1.95 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 2.31 |
| Verpackungsbreite | 7.49 |
| Verpackungslänge | 10.31 |
| Leiterplatte geändert | 16 |
| Standard-Verpackungsname | SO |
| Lieferantenverpackung | SOIC W |
| 16 |
| EDA / CAD Models |