Winbond ElectronicsW632GU6NB11I/REELDRAM-Chip
DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin VFBGA
| Compliant | |
| EAR99 | |
| LTB | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.6(Max) |
| Verpackungsbreite | 7.5 |
| Verpackungslänge | 13 |
| Leiterplatte geändert | 96 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 96 |
| EDA / CAD Models |