Winbond Electronics-W63AH6NBVACI DRAM-Chip LPDDR3 High Speed SDRAM

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Winbond ElectronicsW63AH6NBVACIDRAM-Chip

LPDDR3 High Speed SDRAM

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Symbols and Footprints

Compliant

EAR99

Active

EA

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungshöhe

0.67

Verpackungsbreite

11

Verpackungslänge

11.5

Leiterplatte geändert

178

Standard-Verpackungsname

BGA

Lieferantenverpackung

VFBGA

178

EDA / CAD Models

No Stock Available

Quantity Increments of 1 Minimum 189

Manufacturer Lead Time:
16 Wochen
- Price: 4,0801 €
1. 189+4,0801 €