Winbond ElectronicsW66BL6NBUAFIDRAM-Chip
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Compliant | |
EAR99 | |
Obsolete | |
8542.32.00.36 | |
Automotive | No |
PPAP | No |
Befestigung | Surface Mount |
Verpackungshöhe | 0.47 |
Verpackungsbreite | 10 |
Verpackungslänge | 14.5 |
Leiterplatte geändert | 200 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | WFBGA |
200 |
EDA / CAD Models |