Winbond ElectronicsW66BL6NBUAGIDRAM-Chip
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR4 SDRAM | |
| 2G | |
| 128Mx16 | |
| 8 | |
| 16M | |
| 16 | |
| 16 | |
| 3733 | |
| 3.6 | |
| 17 | |
| LVSTL_11 | |
| 1.06|1.7 | |
| 1.1|1.8 | |
| 1.17|1.95 | |
| 330 | |
| -40 | |
| 95 | |
| 16 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.47 |
| Verpackungsbreite | 10 |
| Verpackungslänge | 14.5 |
| Leiterplatte geändert | 200 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | WFBGA |
| 200 |
| EDA / CAD Models |