Winbond ElectronicsW66BP6NBUAFJDRAM-Chip
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Compliant | |
EAR99 | |
Active | |
EA | |
Automotive | No |
PPAP | No |
Mobile LPDDR4 SDRAM | |
2G | |
128Mx16 | |
8 | |
16M | |
16 | |
16 | |
3200 | |
3.5 | |
17 | |
LVSTL | |
1.06|1.7 | |
1.1|1.8 | |
1.17|1.95 | |
290 | |
-40 | |
105 | |
16 | |
Befestigung | Surface Mount |
Verpackungshöhe | 0.47 |
Verpackungsbreite | 10 |
Verpackungslänge | 14.5 |
Leiterplatte geändert | 200 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | WFBGA |
200 |