Winbond ElectronicsW66CP6RBQAFJDRAM-Chip
DRAM Chip Mobile LPDDR4X SDRAM 4Gbit 256Mx16 1.1V/1.8V 200-Pin TFBGA
| Compliant | |
| EAR99 | |
| Unconfirmed | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.72 |
| Verpackungsbreite | 10 |
| Verpackungslänge | 14.5 |
| Leiterplatte geändert | 200 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 200 |
| EDA / CAD Models |