Winbond ElectronicsW66CQ2NQUAHJDRAM-Chip
DRAM Chip Mobile LPDDR4X SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
Compliant | |
EAR99 | |
Active | |
8542.32.00.36 | |
Automotive | No |
PPAP | No |
Mobile LPDDR4X SDRAM | |
4G | |
128Mx32 | |
8 | |
16M | |
32 | |
32 | |
4267 | |
3.6 | |
17 | |
LVSTL_11 | |
1.06|1.7 | |
1.1|1.8 | |
1.17|1.95 | |
390 | |
-40 | |
105 | |
32 | |
Befestigung | Surface Mount |
Verpackungshöhe | 0.47 |
Verpackungsbreite | 10 |
Verpackungslänge | 14.5 |
Leiterplatte geändert | 200 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | WFBGA |
200 |