Winbond ElectronicsW71NW10GC1DW/TRAYMulti-Chip Package Memory
MCP 128Mx8 Flash + 128Mx16 LPDDR SDRAM 1.8V 130-Pin VFBGA
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 9 |
| Leiterplatte geändert | 130 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 130 |
| EDA / CAD Models |