Winbond ElectronicsW71NW10GE3FWMulti-Chip Package Memory
MCP 1.8V 1Gb NAND Flash and 512Mb DRAM
| Compliant | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 10.5 |
| EDA / CAD Models |
MCP 1.8V 1Gb NAND Flash and 512Mb DRAM
| Compliant | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 10.5 |
| EDA / CAD Models |