Winbond ElectronicsW71NW10GE3FWMulti-Chip Package Memory
MCP 1.8V 1Gb NAND Flash and 512Mb DRAM
| Compliant | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 1G | |
| 512M | |
| Yes | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| -40 | |
| 85 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 10.5 |
| EDA / CAD Models |