Winbond ElectronicsW71NW11GC1DW/TRAYMulti-Chip Package Memory
MCP 64Mx16 Flash + 32Mx16 DDR DRAM 1.8V 130-Pin VFBGA
| Unconfirmed | |
| Automotive | No |
| PPAP | No |
| 1G | |
| 512M | |
| 64Mx16 Flash + 32Mx16 DDR DRAM | |
| Yes | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| -40 | |
| 85 | |
| Industrial | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.68 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 9 |
| Leiterplatte geändert | 130 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 130 |
| EDA / CAD Models |