Winbond ElectronicsW71NW11GF1EWMulti-Chip Package Memory
MCP 64Mx16 Flash + 64Mx16 DDR2 DRAM 1.8V 121-Pin WFBGA
| 3A991b.1.a. | |
| Obsolete | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 1G | |
| 1G | |
| 64Mx16 Flash + 64Mx16 DDR2 DRAM | |
| Yes | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| -40 | |
| 85 | |
| Industrial | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.5 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 121 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | WFBGA |
| 121 |
| EDA / CAD Models |