Winbond ElectronicsW71NW20GD3DWMulti-Chip Package Memory
MCP 16Mx8 Flash + 2Mx32 DDR DRAM 1.8V 130-Pin VFBGA
3A991b.1.a. | |
Active | |
8542.32.00.71 | |
Automotive | No |
PPAP | No |
2G | |
1G | |
16Mx8 Flash + 2Mx32 DDR DRAM | |
Yes | |
1.7 | |
1.8 | |
1.95 | |
-40 | |
85 | |
Industrial | |
Befestigung | Surface Mount |
Verpackungshöhe | 0.68 |
Verpackungsbreite | 8 |
Verpackungslänge | 9 |
Leiterplatte geändert | 130 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | VFBGA |
130 |