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Winbond ElectronicsW71NW20GF3FW | Multi-Chip Packaged (MCP) MemoryMulti-Chip Package Memory
MCP 16Mx8 Flash + 2Mx32 DDR2 DRAM 1.8V 162-Pin VFBGA
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 2G | |
| 1G | |
| 16Mx8 Flash + 2Mx32 DDR2 DRAM | |
| Yes | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| -40 | |
| 85 | |
| Industrial | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.73(Max) |
| Verpackungsbreite | 8 |
| Verpackungslänge | 10.5 |
| Leiterplatte geändert | 162 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 162 |
| EDA / CAD Models |