Winbond Electronics-W955D8MBYA6I/TRAY DRAM-Chip null

Video Transcript

Winbond ElectronicsW955D8MBYA6I/TRAYDRAM-Chip

Mobile DRAM Chip

Symbols and Footprints

EAR99

Obsolete

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungshöhe

0.85

Verpackungsbreite

6

Verpackungslänge

8

Leiterplatte geändert

24

Standard-Verpackungsname

BGA

Lieferantenverpackung

TFBGA

24

EDA / CAD Models

A datasheet is only available for this product at this time.