Winbond ElectronicsW957A8MFYA5IDRAM-Chip
DRAM Chip Mobile-DDR SDRAM 128Mbit 16Mx8 3V 24-Pin TFBGA
| Compliant | |
| EAR99 | |
| Active | |
| 8542.32.00.02 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85 mm |
| Verpackungsbreite | 6 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |