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Winbond ElectronicsW979H2KBQX2IDRAM-Chip
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.32 | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR2 SDRAM | |
| 512M | |
| 16Mx32 | |
| 4 | |
| 4M | |
| 32 | |
| 32 | |
| 400 | |
| 5.5 | |
| 15 | |
| HSUL_12 | |
| 1.14|1.7 | |
| 1.2|1.8 | |
| 1.3|1.95 | |
| 175 | |
| -40 | |
| 85 | |
| 32 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.45 mm |
| Verpackungsbreite | 12 mm |
| Verpackungslänge | 12 mm |
| Leiterplatte geändert | 168 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | WFBGA |
| 168 | |
| Leitungsform | Ball |
| EDA / CAD Models |