Winbond ElectronicsW979H2KBVX2IDRAM-Chip
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 134-Pin VFBGA
Compliant | |
EAR99 | |
Active | |
8542.32.00.36 | |
Automotive | No |
PPAP | No |
Mobile LPDDR2 SDRAM | |
512M | |
16Mx32 | |
4 | |
4M | |
32 | |
32 | |
400 | |
5.5 | |
15 | |
HSUL_12 | |
1.14|1.7 | |
1.2|1.8 | |
1.3|1.95 | |
175 | |
-40 | |
85 | |
32 | |
Befestigung | Surface Mount |
Verpackungshöhe | 0.58 mm |
Verpackungsbreite | 10 mm |
Verpackungslänge | 11.5 mm |
Leiterplatte geändert | 134 |
Standard-Verpackungsname | BGA |
Lieferantenverpackung | VFBGA |
134 | |
Leitungsform | Ball |