Winbond ElectronicsW97AH6KBVX2IDRAM-Chip
DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8473.30.11.40 | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR2 SDRAM | |
| 1G | |
| 64Mx16 | |
| 8 | |
| 8M | |
| 16 | |
| 16 | |
| 400 | |
| 5.5 | |
| 16 | |
| HSUL_12 | |
| 1.14|1.7 | |
| 1.2|1.8 | |
| 1.3|1.95 | |
| 200 | |
| -40 | |
| 85 | |
| 16 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.58 mm |
| Verpackungsbreite | 10 mm |
| Verpackungslänge | 11.5 mm |
| Leiterplatte geändert | 134 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 134 | |
| Leitungsform | Ball |
| EDA / CAD Models |