Winbond ElectronicsW97AH6KBVX2IDRAM-Chip
DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8473.30.11.40 | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.58 mm |
| Verpackungsbreite | 10 mm |
| Verpackungslänge | 11.5 mm |
| Leiterplatte geändert | 134 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 134 | |
| Leitungsform | Ball |
| EDA / CAD Models |