Winbond Electronics-W9825G2JB-75/TRAY DRAM-Chip null

Video Transcript

Winbond ElectronicsW9825G2JB-75/TRAYDRAM-Chip

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA

Symbols and Footprints

EAR99

Obsolete

Automotive

No

PPAP

No

Befestigung

Surface Mount

Verpackungshöhe

0.8(Max)

Verpackungsbreite

8

Verpackungslänge

13

Leiterplatte geändert

90

Standard-Verpackungsname

BGA

Lieferantenverpackung

TFBGA

90

Leitungsform

Ball

EDA / CAD Models

A datasheet is only available for this product at this time.