Winbond ElectronicsW988D2FBJX7EDRAM-Chip
DRAM Chip Mobile LPSDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.24 | |
| Automotive | No |
| PPAP | No |
| Mobile LPSDR SDRAM | |
| 256M | |
| 8Mx32 | |
| 4 | |
| 2M | |
| 32 | |
| 32 | |
| 133 | |
| 8|5.4 | |
| 14 | |
| LVCMOS | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| 70 | |
| -25 | |
| 85 | |
| Extended | |
| 32 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.66 mm |
| Verpackungsbreite | 8 mm |
| Verpackungslänge | 13 mm |
| Leiterplatte geändert | 90 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 90 | |
| Leitungsform | Ball |
| EDA / CAD Models |