TE Connectivity2065657-1Steckverbinder, Mutterplatine

The Z-PACK slim UHD connectors are high-density pin-count connectors that free up PCB space and can fit in tight, 15-mm slot-pitch applications. The Z-PACK range of connectors can provide data transfer rates of 12.5 Gbps while being scalable up to 20 Gbps without needing to change the existing PCB layout. The flexible pin arrangement of the Z-PACK connectors provides multiple pin assignments and 55 signal lines per square centimeter. The Z-PACK connectors use a drill size of 0.5 mm and a pad size of 0.8 mm, which allows for 4-6-4 MIL or 5-7-5 MIL differential routing.

Drawings/Package

  

Key Features

• High density signal count of 55 signals per square centimeter

• Typical data transfer speed of 12.5 Gbps scalable to 20 Gbps

• Fits into tight, 15mm slot-pitch applications

• Pin assignments for 1.5 and 2.0 differential pairs per column

• Footprint allows for 4-6-4 MIL or 5-7-5 MIL differential routing

General Applications

• Switches

• Routers

• Servers

• Telecommunication equipment

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This hard metric 2065657-1 backplane connector from TE Connectivity will not only link multiple connectors together but also provide an interface between the devices. This F connector's 80 contacts that are made out of copper-nickel-silicon and plated with tin over nickel. Its pitch is 2.5 mm. It has a female type gender. This is a 8-row connector. It has a right angle body orientation. This product is 24.95 mm long, 21.35 mm tall and 28.9 mm deep. 2065657-1 is housed in polyester. It uses the press fit termination method.