The emergence of faster data rates and decreasing signal rise times requires better performing, high-speed connectors. TE Connectivity’s broad portfolio of high speed backplane connectors provide system designers the flexibility they require to solve their specific performance challenges.
The Z-PACK slim UHD connectors are high-density pin-count connectors that free up PCB space and can fit in tight, 15-mm slot-pitch applications. The Z-PACK range of connectors can provide data transfer rates of 12.5 Gbps while being scalable up to 20 Gbps without needing to change the existing PCB layout. The flexible pin arrangement of the Z-PACK connectors provides multiple pin assignments and 55 signal lines per square centimeter. The Z-PACK connectors use a drill size of 0.5 mm and a pad size of 0.8 mm, which allows for 4-6-4 MIL or 5-7-5 MIL differential routing. Applications span servers, switches, routers, and optical solutions.
Product Brief Video
Drawings/Package
Speed Scalability and Configuration
Space Savings
Key Features
- High density signal count of 55 signals per square centimeter
- Typical data transfer speed of 12.5 Gbps scalable to 20 Gbps
- Fits into tight, 15mm slot-pitch applications
- Pin assignments for 1.5 and 2.0 differential pairs per column
- Footprint allows for 4-6-4 MIL or 5-7-5 MIL differential routing
General Applications
- Switches
- Routers
- Servers
- Telecommunication equipment