Maximum Orderable Quantity of 3 Units
ADAQ4003: 18-Bit, 2 MSPS μModule Data Acquisition Solution
The ADAQ4003 is a μModule precision data acquisition solution that reduces the development cycle of a precision measurement system by transferring the signal chain design challenge of component selection, optimization, and layout from designer to device.
Using System-in-Package (SIP) technology, the ADAQ4003 reduces end system component count by combining multiple common signal processing and conditioning blocks into a single device including a low noise, fully differential ADC driver, a stable reference buffer, and a high resolution 18-bit, 2MSPS successive approximation register (SAR) ADC. It also incorporates the critical passive components necessary for peak circuit operation. The extraordinary matching and drift characteristics of the resistors implemented with the proprietary iPassive process minimize time and temperature dependent error sources. Fast settling characteristics of the ADC driver stage along with a wide common-mode input range, high output data rate, and exceptional accuracy provide a unique and differentiated solution for a diverse variety of precision measurement applications.
The small footprint 7x7 mm BGA package increases solution density without sacrificing any performance. The combination of signal chain blocks into one component solves many design challenges, yet the device still provides the flexibility of a configurable ADC driver stage to allow for gain or attenuation adjustments. The ADAQ4003 can operate in either a fully differential or single ended-to-differential input configuration. Single 5.5V supply operation is possible while still achieving optimum performance from the device.
The SPI-compatible serial user interface is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic, using the separate VIO supply. Specified operation of ADAQ4003 is from −40°C to +125°C.
The ADAQ4003 enables customers to:
1) Use a component that encompasses more of the signal chain within one component and covered by one data sheet
2) Transfer design burden of component selection, optimization, and layout from designer to device
3) Achieve higher PCB density without impacting performance and without thermal dissipation issues
4) Achieve datasheet performance easier without any PCB debug
5) Reduce PCB component count which improves manufacturability
| Compliant | |
| EAR99 | |
| Unconfirmed | |
| 8542.39.00.60 |
| EDA / CAD Models |