Samsung ElectronicsCL21B474KAFNNNEKondensator, keramisch, mehrschichtig
Cap Ceramic 0.47uF 25V X7R 10% Pad SMD 0805 125°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 0.47uF | |
| 10% | |
| 25VDC | |
| X7R | |
| Standard | |
| Yes | |
| Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range|Highly Reliable Performance | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 2.5 | |
| 2 X 1.25 X 1.25 | |
| 0805 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2 | |
| 1.25 | |
| 1.25 | |
| 0.016523 | |
| ±0.1 | |
| ±0.1 | |
| ±0.1 |
| EDA / CAD Models |