CUI DevicesHSB02-101007Kühlkörper
Heat Sink Passive BGA Pin Array Adhesive Aluminum 6063-T5 16.5°C/W Black Anodized
| Compliant | |
| EAR99 | |
| Active | |
| 8542.90.00.00 | |
| Automotive | No |
| PPAP | No |
| EDA / CAD Models |
Heat Sink Passive BGA Pin Array Adhesive Aluminum 6063-T5 16.5°C/W Black Anodized
| Compliant | |
| EAR99 | |
| Active | |
| 8542.90.00.00 | |
| Automotive | No |
| PPAP | No |
| EDA / CAD Models |